FR4 PCB
FR4 PCB는 난연성 에폭시 수지와 유리 섬유를 결합해 제작한 대표적인 PCB 기판입니다.
이 소재는 높은 절연 강도와 우수한 강도 대비 경량, 습기와 열에 대한 내성, 그리고 합리적인 비용 효율성을 갖추고 있습니다.
FR4 PCB Capabilities
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 32 Layers |
| Max Board Dimension | 24*24″ (610*610mm) |
| Min Board Thickness | 0.15mm |
| Max Board Thickness | 6.0mm – 8.0mm |
| Copper Thickness | Outer Layer: 1oz~30oz, Inner Layer: 0.5oz~30oz |
| Min Line Width/Line Space | Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm) |
| Min Hole Diameter | Normal: 8mil (0.20mm); HDI: 4mil (0.10mm) |
| Min Punch Hole Dia | 0.1″ (2.5mm) |
| Min Hole Spacing | 12 mil (0.3mm) |
| Min PAD Ring(Single) | 3mil (0.075mm) |
| PTH Wall Thickness | Normal: 0.59mil (15um); HDI: 0.48mil (12um) |
| Min Solder PAD Dia | Normal: 14mil (0.35mm); HDI: 10mil(0.25mm) |
| Min Soldermask Bridge | Normal: 8mil (0.2mm); HDI: 6mil (0.15mm) |
| Min BAG PAD Margin | 5mil (0.125mm) |
| PTH/NPTH Dia Tolerance | PTH: ± 3mil (0.075mm); NPTH: ±2 mil (0.05mm) |
| Hole Position Deviation | ±2 mil (0.05mm) |
| Outline Tolerance | CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm) |
| Impedance Controlled | Value > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating, ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
| Soldermask Color | Green/White/Black/Yellow/Blue/Red |
FR4 PCB Material
| Item | Attribute |
|---|---|
| Brand | KB / SYL / Nanya / Isola / Nelco / Rogers / Taconic / Arlon / Hitachi / Panasonic / ITEQ |
| Material Type | FR4 / FR-5 / CEM – 1 / CEM – 3 / FR1 |
| Thickness | 0.10mm / 0.12mm / 0.15mm / 0.20mm / 0.25mm / 0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / ≥ 2.0 mm |
| Tg Value | > 130 / 150 / 170 / 180 |
| Halogen Free | Yes (optional) |
| ROHS | Yes |
| Flammability | 94V-0 |
| Thermal Conductivity (W/m.K) | 0.30 – 0.45 |
| Dielectric Strength | > 1.3 KV / mm |
| Wrap & Twist | ≤ 0.75% |
| Thermal Stress | 3 x 10 Sec @ 280 ℃ |
Prototype Lead Time
| Production | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| FR4 PCB | 1 Layer | 4-6 days | 2-3 days |
| 2 Layers | 5-8 days | 2-3 days | |
| 4 Layers | 8-12 days | 3-5 days | |
| 6 Layers | 8-12 days | 4-6 days | |
| 8 Layers | 12-16 days | 6-8 days | |
| 10 Layers | 18-20 days | TBD | |
| HDI (1+N+1, 2+N+2) | 3-4 weeks | TBD |
Mass Production Lead Time
| Production | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| FR4 PCB | 1 Layer | 4-6 days | 2-3 days |
| 2 Layers | 5-8 days | 2-3 days | |
| 4 Layers | 8-12 days | 3-5 days | |
| 6 Layers | 8-12 days | 4-6 days | |
| 8 Layers | 12-16 days | 6-8 days | |
| 10 Layers | 18-20 days | TBD | |
| HDI(1+N+1, 2+N+2) | 3-4 weeks | TBD |
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 32 Layers |
| Max Board Dimension | 24*24″ (610*610mm) |
| Min Board Thickness | 0.15mm |
| Max Board Thickness | 6.0mm – 8.0mm |
| Copper Thickness | Outer Layer: 1oz~30oz, Inner Layer: 0.5oz~30oz |
| Min Line Width/Line Space | Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm) |
| Min Hole Diameter | Normal: 8mil (0.20mm); HDI: 4mil (0.10mm) |
| Min Punch Hole Dia | 0.1″ (2.5mm) |
| Min Hole Spacing | 12 mil (0.3mm) |
| Min PAD Ring(Single) | 3mil (0.075mm) |
| PTH Wall Thickness | Normal: 0.59mil (15um); HDI: 0.48mil (12um) |
| Min Solder PAD Dia | Normal: 14mil (0.35mm); HDI: 10mil(0.25mm) |
| Min Soldermask Bridge | Normal: 8mil (0.2mm); HDI: 6mil (0.15mm) |
| Min BAG PAD Margin | 5mil (0.125mm) |
| PTH/NPTH Dia Tolerance | PTH: ± 3mil (0.075mm); NPTH: ±2 mil (0.05mm) |
| Hole Position Deviation | ±2 mil (0.05mm) |
| Outline Tolerance | CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm) |
| Impedance Controlled | Value > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating, ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
| Soldermask Color | Green/White/Black/Yellow/Blue/Red |
| Item | Attribute |
|---|---|
| Brand | KB / SYL / Nanya / Isola / Nelco / Rogers / Taconic / Arlon / Hitachi / Panasonic / ITEQ |
| Material Type | FR4 / FR-5 / CEM – 1 / CEM – 3 / FR1 |
| Thickness | 0.10mm / 0.12mm / 0.15mm / 0.20mm / 0.25mm / 0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / ≥ 2.0 mm |
| Tg Value | > 130 / 150 / 170 / 180 |
| Halogen Free | Yes (optional) |
| ROHS | Yes |
| Flammability | 94V-0 |
| Thermal Conductivity (W/m.K) | 0.30 – 0.45 |
| Dielectric Strength | > 1.3 KV / mm |
| Wrap & Twist | ≤ 0.75% |
| Thermal Stress | 3 x 10 Sec @ 280 ℃ |
| Production | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| FR4 PCB | 1 Layer | 4-6 days | 2-3 days |
| 2 Layers | 5-8 days | 2-3 days | |
| 4 Layers | 8-12 days | 3-5 days | |
| 6 Layers | 8-12 days | 4-6 days | |
| 8 Layers | 12-16 days | 6-8 days | |
| 10 Layers | 18-20 days | TBD | |
| HDI (1+N+1, 2+N+2) | 3-4 weeks | TBD |
| Prototype(<1m²) | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| FR4 PCB | 1 Layer | 3 – 4 days | 24 hours |
| 2 Layers | 4 – 6 days | 24 hours | |
| 4 Layers | 8 – 10 days | 48 hours | |
| 6 Layers | 8 – 10 days | 72 hours | |
| 8 Layers | 10 – 14 days | 72 – 96 hours | |
| 10 Layers | 14 – 18 days | 120 – 168 hours | |
| HDI (1+N+1, 2+N+2) | 2.5 – 3.5 weeks | TBD |
적용사례
고객의 경쟁 우위 확보를 위한 최적의 파트너가 되겠습니다.
지능형 트래킹 제품군용 FR4 PCB
- Layer Count: 4 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.26mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: ENIG1u”
- Solder Mask: Yellow Coverly With Orange
헬스케어 모니터링 초박판 PCB
- Layer Count: 2 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.13mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: ENIG3u”
전기차 충전용 고중량 구리 PCB
- Layer Count: 4 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.25mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: Gold Plated 20u”