메탈코어 PCB – Korea Master Technology

Metal Core PCB

메탈 코어(Metal Core) PCB는 기판이나 베이스에 금속을 사용하여 제작한 인쇄회로기판입니다.

금속 재료는 뛰어난 열 분산, 안정적인 자기 전도성, 견고한 기계적 강도와 우수한 가공성을 갖추고 있습니다.

Metal Core PCB Capabilities

Item	Capabilities
Layer Count	1 – 10 Layers
Max Board Dimension	2464″(6101625mm)
Min Board Thickness	0.6mm
Max Board Thickness	4.0mm
Conductor Thickness	0.5oz – 10oz
Min Line Width/Line Space	4/4mil (0.10/0.10mm)
Min Hole Diameter	10mil (0.25mm)
Min Punch Hole Dia	0.12″ (3.0mm)
Min Hole Spacing	16mil (0.4mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia	14mil (0.35mm)
Min Soldermask Bridge	8mil (0.20mm)
Min BAG PAD Margin	5mil (0.125mm)
PTH/NPTH Dia Tolerance	PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation	±3mil (0.075mm)
Outline Tolerance	CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio	10:1
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm

Metal Core PCB Material

Item	Attribute
Brand	Bergquist / Bode / Boyu / Larid / Metal board / Ventec
Base Material	Aluminum / Copper / Stainless steel
Base Material Thickness	0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / 2.0 mm / 2.4mm / 3.0mm
Thermal Conductivity	1W / 1.5W / 2.0W / 3.0W
Soldermask Type	Soldermask oil (white, black, green, blue, yellow, red)
Tg Value	130 / 150
Halogen Free	Yes (optional)
ROHS	Yes
Flammability	94V-0
Thermal Conductivity (W/m.K)	Normal: 0.8~1.0, 1.5; High: 2.0, 3.0
Dielectric Strength	> 1.5 Kv (L/S > 1.5mm); > 3.0 Kv (L/S > 3.0mm)
Wrap & Twist	≤ 0.75%
Thermal Stress	3 x 10 Sec @ 280 ℃

Prototype Lead Time

Prototype(<1m²)	Layers	Normal Service	Expedited Service
Metal Core PCB	1 Layer	1 – 1.5 weeks	48 hours
	2 Layers	2.5 – 3 weeks	168 hours
	4 Layers	3 – 4 weeks	1.5 weeks
	6 Layers	4 – 5 weeks	2 weeks
	8 Layers	5 – 6 weeks	TBD
	10 Layers	6 – 7 weeks	TBD

Mass Production Lead Time

Mass Production	Layers	Normal Service	Expedited Service
Metal Core PCB	1 Layer	2 – 2.5 weeks	1 week
	2 Layers	3 – 4 weeks	1.5 – 2 weeks
	4 Layers	4 – 5 weeks	2 weeks
	6 Layers	5 – 6 weeks	2.5 weeks
	8 Layers	6 – 7 weeks	3 – 4 weeks
	10 Layers	7 – 8 weeks	TBD

Item	Capabilities
Layer Count	1 – 10 Layers
Max Board Dimension	2464″(6101625mm)
Min Board Thickness	0.6mm
Max Board Thickness	4.0mm
Conductor Thickness	0.5oz – 10oz
Min Line Width/Line Space	4/4mil (0.10/0.10mm)
Min Hole Diameter	10mil (0.25mm)
Min Punch Hole Dia	0.12″ (3.0mm)
Min Hole Spacing	16mil (0.4mm)
Min PAD Ring(Single)	3mil (0.075mm)
PTH Wall Thickness	Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia	14mil (0.35mm)
Min Soldermask Bridge	8mil (0.20mm)
Min BAG PAD Margin	5mil (0.125mm)
PTH/NPTH Dia Tolerance	PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation	±3mil (0.075mm)
Outline Tolerance	CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio	10:1
Surface Treatment	ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm

Item	Attribute
Brand	Bergquist / Bode / Boyu / Larid / Metal board / Ventec
Base Material	Aluminum / Copper / Stainless steel
Base Material Thickness	0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / 2.0 mm / 2.4mm / 3.0mm
Thermal Conductivity	1W / 1.5W / 2.0W / 3.0W
Soldermask Type	Soldermask oil (white, black, green, blue, yellow, red)
Tg Value	130 / 150
Halogen Free	Yes (optional)
ROHS	Yes
Flammability	94V-0
Thermal Conductivity (W/m.K)	Normal: 0.8~1.0, 1.5; High: 2.0, 3.0
Dielectric Strength	> 1.5 Kv (L/S > 1.5mm); > 3.0 Kv (L/S > 3.0mm)
Wrap & Twist	≤ 0.75%
Thermal Stress	3 x 10 Sec @ 280 ℃

Prototype(<1m²)	Layers	Normal Service	Expedited Service
Metal Core PCB	1 Layer	1 – 1.5 weeks	48 hours
	2 Layers	2.5 – 3 weeks	168 hours
	4 Layers	3 – 4 weeks	1.5 weeks
	6 Layers	4 – 5 weeks	2 weeks
	8 Layers	5 – 6 weeks	TBD
	10 Layers	6 – 7 weeks	TBD

Mass Production	Layers	Normal Service	Expedited Service
Metal Core PCB	1 Layer	2 – 2.5 weeks	1 week
	2 Layers	3 – 4 weeks	1.5 – 2 weeks
	4 Layers	4 – 5 weeks	2 weeks
	6 Layers	5 – 6 weeks	2.5 weeks
	8 Layers	6 – 7 weeks	3 – 4 weeks
	10 Layers	7 – 8 weeks	TBD

메탈 코어 PCB(MCPCB)는 탁월한 열 관리 성능을 바탕으로 고출력 LED 조명, 통신 인프라, 전원 장치 등 강력한 방열 솔루션이 필요한 전 산업 분야에 필수적으로 사용됩니다.