최적화된 PCB 프로토타입 제작
PCB 시제품 제작은 설계 완성도를 높이고, 양산 리스크를 줄이는 핵심 단계입니다. 초기 오류를 사전에 개선함으로써 양산 과정에서의 시간과 비용 손실을 효과적으로 방지합니다.
또한 저희는 기존 회로 및 장치 구조에 대한 분석을 통해, 성능과 효율을 향상시키는 최적화된 설계 방향을 제안합니다.
양산을 고려한 PCB 프로토타입 제작
고객 맞춤형 기술 지원 및 공정 개선 제안
설계 검토 기반 시제품 제작 효율화
DFM 기반 PCB 설계 파일 검증
PCB 파일을 정밀하게 검토하여 부품 누락과 설계 오류를 사전에 확인하고, 설계가 저희 생산 공정에서 원활히 제작될 수 있는지 철저히 점검합니다.
PCB 제작 비용 절감 솔루션
프로토타입 설계 효율화와 비용 절감을 위해, 경험 많은 제조 전문가가 맞춤 솔루션을 제공합니다.
신뢰할 수 있는 프로토타입 품질 제공
실제 생산 제품과 동일한 품질 기준으로 제작되는 프로토타입으로, 양산 단계에서도 흔들림 없는 품질을 제공합니다.
PCB 시제품 종류
저희가 보유한 주요 PCB 제작 역량입니다. 프로젝트 요구에 따라 맞춤형 확장 솔루션까지 지원합니다.
FR4 PCB
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 32 Layers |
| Max Board Dimension | 24 × 24″ (610 × 610 mm) |
| Min Board Thickness | 0.15 mm |
| Max Board Thickness | 6.0 – 8.0 mm |
| Copper Thickness | Outer Layer: 1 oz ~ 30 ozInner Layer: 0.5 oz ~ 30 oz |
| Min Line Width / Line Space | Normal: 4/4 mil (0.10 mm)HDI: 3/3 mil (0.076 mm) |
| Min Hole Diameter | Normal: 8 mil (0.20 mm)HDI: 4 mil (0.10 mm) |
| Min Punch Hole Dia | 0.1″ (2.5 mm) |
| Min Hole Spacing | 12 mil (0.3 mm) |
| Min PAD Ring (Single) | 3 mil (0.075 mm) |
| PTH Wall Thickness | Normal: 0.59 mil (15 µm)HDI: 0.48 mil (12 µm) |
| Min Solder PAD Dia | Normal: 14 mil (0.35 mm)HDI: 10 mil (0.25 mm) |
| Min Soldermask Bridge | Normal: 8 mil (0.2 mm)HDI: 6 mil (0.15 mm) |
| Min BGA PAD Margin | 5 mil (0.125 mm) |
| PTH / NPTH Dia Tolerance | PTH: ±3 mil (0.075 mm)NPTH: ±2 mil (0.05 mm) |
| Hole Position Deviation | ±2 mil (0.05 mm) |
| Outline Tolerance | CNC: ±6 mil (0.15 mm)Die Punch: ±4 mil (0.1 mm)Precision Die: ±2 mil (0.05 mm) |
| Impedance Controlled | Value > 50 Ω: ±10%Value ≤ 50 Ω: ±5 Ω |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating (50 mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL (LF), OSP, Silver Immersion, Tin Immersion |
| Soldermask Color | Green / White / Black / Yellow / Blue / Red |
Metal Core PCB
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 10 Layers |
| Max Board Dimension | 24 × 64″ (610 × 1625 mm) |
| Min Board Thickness | 0.6 mm |
| Max Board Thickness | 4.0 mm |
| Conductor Thickness | 0.5 oz – 10 oz |
| Min Line Width / Line Space | 4/4 mil (0.10 / 0.10 mm) |
| Min Hole Diameter | 10 mil (0.25 mm) |
| Min Punch Hole Dia | 0.12″ (3.0 mm) |
| Min Hole Spacing | 16 mil (0.4 mm) |
| Min PAD Ring (Single) | 3 mil (0.075 mm) |
| PTH Wall Thickness | Normal: 0.59 mil (15 µm)HDI: 0.48 mil (12 µm) |
| Min Solder PAD Dia | 14 mil (0.35 mm) |
| Min Soldermask Bridge | 8 mil (0.20 mm) |
| Min BGA PAD Margin | 5 mil (0.125 mm) |
| PTH / NPTH Dia Tolerance | PTH: ±3 mil (0.075 mm)NPTH: ±2 mil (0.05 mm) |
| Hole Position Deviation | ±3 mil (0.075 mm) |
| Outline Tolerance | CNC: ±6 mil (0.15 mm)Die Punch: ±6 mil (0.1 mm) |
| Max Aspect Ratio | 10:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating (50 mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL (LF), OSP, Silver Immersion, Tin Imm |
Ceramic PCB
| Item | Thick Film Capabilities | DCB/DBC Capabilities | DPC Capabilities | AMB Capabilities |
|---|---|---|---|---|
| Layer Count | 10 Layers | 2 Layers | 2 Layers | 2 Layers |
| Max Board Dimension | 138 × 190 mm | 138 × 178 mm | 138 × 190 mm | 114 × 114 mm |
| Min Board Thickness | 0.25 mm | 0.30 to 0.40 mm | 0.25 mm | 0.25 mm |
| Max Board Thickness | 2.0 mm | 1L: 1.3 mm, 2L: 1.6 mm | 2.0 mm | 1.8 mm |
| Conductor Thickness | 5 µm to 13 µm | 0.10 mm to 0.30 mm | 2 µm to 200 µm | 0.25 mm to 0.80 mm |
| Min Line Width/Line Space | 6/8 mil (0.15/0.20 mm) | 12/12 mil (0.30/0.30 mm) | 6/8 mil (0.15/0.20 mm) | 20/20 mil (0.50/0.50 mm) |
| Substrate Type | Al₂O₃, AlN, BeO, ZrO₂ | Al₂O₃, AlN, ZrO₂ | Al₂O₃, AlN, ZrO₂, Si₃N₄ | Al₂O₃, AlN, Si₃N₄ |
| Substrate Thickness | 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0 mm | 0.25, 0.38, 0.50, 0.635, 0.76, 1.0, 1.5, 2.0 mm | 0.25, 0.38, 0.50, 0.635, 0.80, 1.0, 1.5, 2.0 mm | 0.25, 0.38, 0.50, 0.635, 0.76, 1.0 mm |
| Min Hole Diameter | 4 mil (0.1 mm) | |||
| Min Hole Spacing | NPTH: 16 mil (0.30 mm), PTH: 20 mil (0.5 mm) | |||
| Min PAD Ring (Single) | 6 mil (0.15 mm) | N/A | 3 mil (0.075 mm) | N/A |
| PTH Wall Thickness | 4 mil (10 µm) | N/A | 4 mil (10 µm) | N/A |
| Min Solder PAD Dia | 10 mil (0.25 mm) | 8 mil (0.20 mm) | 6 mil (0.15 mm) | 8 mil (0.20 mm) |
| Min Soldermask Bridge | 12 mil (0.30 mm) | 8 mil (0.20 mm) | 6 mil (0.15 mm) | 8 mil (0.20 mm) |
| Min BGA PAD Margin | 12 mil (0.30 mm) | 8 mil (0.20 mm) | 5 mil (0.125 mm) | 8 mil (0.20 mm) |
| PTH/NPTH Dia Tolerance | PTH: ±4 mil (0.1 mm), NPTH: ±2 mil (0.05 mm) | |||
| Hole Position Deviation | ±4 mil (0.1 mm) | |||
| Outline Tolerance | Laser: +0.20/0.05 mm | |||
| Line Width/Space Tolerance | ±5 mil (0.125 mm) | ±5 mil (0.125 mm) | ±1 mil (0.025 mm) | ±5 mil (0.125 mm) |
| Surface Treatment | AgPd, AgPt, Au | OSP, Ni Plating, ENIG, ENEPIG | ||
| Thermal Stress | 1 hour at 350℃ | 3 × 10 sec at 280℃ | 15 min at 350℃ | 3 × 10 sec at 280℃ |
Flexible PCB
| Item | Capabilities |
|---|---|
| Layer CountA | 1 to 30 Layers |
| Max Board Dimension | 1L: 500 × 2000 mm; 2L: 250 × 1380 mm |
| Min Board Thickness | 0.05 mm |
| Max Board Thickness | 3.0 mm |
| Conductor Thickness | 1/3 OZ (12 µm) to 4 OZ (140 µm) |
| Min Line Width/Line Space | 2/2 mil (0.05/0.05 mm) |
| Min Hole Diameter | 4 mil (0.10 mm) |
| Min Hole Spacing | NPTH: 16 mil (0.4 mm); PTH: 20 mil (0.5 mm) |
| Min PAD Ring (Single) | 3 mil (0.075 mm) |
| PTH Wall Thickness | 0.59 mil (15 µm) |
| Min Solder PAD Dia | 10 mil (0.25 mm) |
| Min Soldermask Bridge | 12 mil (0.30 mm) |
| Min BGA PAD Margin | 12 mil (0.30 mm) |
| PTH/NPTH Dia Tolerance | PTH: ±3 mil (0.075 mm); NPTH: ±2 mil (0.05 mm) |
| Hole Position Deviation | ±4 mil (0.10 mm) |
| Outline Tolerance | Laser: +0.15 mm / -0.05 mm; Die Punch: +0.10 / -0.20 mm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating (50 mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
| Impedance Controlled | Value > 50 ohm: ±10%; Value ≤ 50 ohm: ±5 ohm |
Rigid-Flex PCB
| Item | Capabilities |
|---|---|
| Layer Count | 2 to 50 Layers |
| Max Board Dimension | 500 × 500 mm |
| Min Board Thickness | 0.30 mm |
| Max Board Thickness | 4.0 mm |
| Conductor Thickness | 0.5 oz (18 µm) to 2 oz (70 µm) |
| Min Line Width/Line Space | 3/3 mil (0.075/0.075 mm) |
| Min Hole Diameter | 4 mil (0.10 mm) |
| Min Hole Spacing | NPTH: 16 mil (0.4 mm); PTH: 20 mil (0.5 mm) |
| Min PAD Ring (Single) | 3 mil (0.075 mm) |
| PTH Wall Thickness | 0.59 mil (15 µm) |
| Min Solder PAD Dia | 10 mil (0.25 mm) |
| Min Soldermask Bridge | 12 mil (0.30 mm) |
| Min BGA PAD Margin | 12 mil (0.30 mm) |
| PTH/NPTH Dia Tolerance | PTH: ±3 mil (0.075 mm); NPTH: ±2 mil (0.05 mm) |
| Hole Position Deviation | ±4 mil (0.10 mm) |
| Outline Tolerance | Laser: +0.15 mm / -0.05 mm; Die Punch: +0.10 / -0.20 mm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating (50 mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
| Impedance Controlled | Value > 50 ohm: ±10%; Value ≤ 50 ohm: ±5 ohm |