Rigid-Flex PCB

Rigid-Flex PCB는 유연한 플렉시블 기판과 단단한 리지드 기판이 하나로 결합된 형태입니다. 이 기판은 협소한 공간에서도 복잡한 회로 설계를 가능하게 하며, 가벼운 무게와 소형화, 그리고 높은 신뢰성을 갖추고 있어 정밀 전자 기기에 최적화되어 있습니다.

지금 견적 받기
Rigid-Flex PCB Capabilities
ItemCapabilities
Layer Count2 – 50 Layers
Max Board Dimension500*500mm
Min Board Thickness0.30mm
Max Board Thickness4.0mm
Conductor Thickness0.5oz(18 um) – 2oz(70um)
Min Line Width/Line Space3/3mil (0.075/0.075mm)
Min Hole Diameter4mil (0.10mm)
Min Hole SpacingNPTH: 16mil (0.4mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)3mil (0.075mm)
PTH Wall Thickness0.59mil (15um)
Min Solder PAD Dia10mil (0.25mm)
Min Soldermask Bridge12mil (0.30mm)
Min BGA PAD Margin12mil (0.30mm)
PTH/NPTH Dia TolerancePTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation±4mil (0.10mm)
Outline ToleranceLaser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio8:1
Surface TreatmentENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance ControlledValue > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm
Rigid-Flex PCB Material
ItemAttribute
BrandDupont / Doosan / Grace / KB / Rogers / Panasonic / SYL / Tailfex / ThinFlex / Ventec
Base MaterialPolyimide / FR4
Base Material Thickness (FCCL)12um / 18um / 25um / 50um / 75um / 100um / 125um / 150um
Base Material Thickness (CCL)0.10mm / 0.12mm / 0.15mm / 0.20mm / 0.25mm / 0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / 2.0 mm
Coverlay TypePolyimide / Soldermask oil
Tg Value130 / 150 / 170
Halogen Free (optional)Yes
ROHSYes
Flammability94V-0
Dielectric Strength≥ 1.3KV/mm
Wrap & Twist≤ 1%
Prototype Lead Time
Prototype(<1m²)LayersNormal ServiceExpedited Service
Rigid-flex PCB2 Layers1.5 – 2 weeks5 days
3 Layers2 – 2.5 weeks6 days
4 Layers2.5 – 3.5 weeks1 week
6 Layers3.5 – 4 weeks1.5 weeks
8 – 12 Layers4 – 5 weeks2 weeks
Mass Production Lead Time
Mass Production Layers Normal Service Expedited Service
Rigid-flex PCB 2 Layers 2.5 – 3.5 weeks 1.5 weeks
3 Layers 3 – 4 weeks 2 weeks
4 Layers 4 – 5 weeks 2.5 weeks
6 Layers 5 – 6 weeks 3 weeks
8 – 12 Layers 6 – 8 weeks 3.5 weeks
ItemCapabilities
Layer Count2 – 50 Layers
Max Board Dimension500*500mm
Min Board Thickness0.30mm
Max Board Thickness4.0mm
Conductor Thickness0.5oz(18 um) – 2oz(70um)
Min Line Width/Line Space3/3mil (0.075/0.075mm)
Min Hole Diameter4mil (0.10mm)
Min Hole SpacingNPTH: 16mil (0.4mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)3mil (0.075mm)
PTH Wall Thickness0.59mil (15um)
Min Solder PAD Dia10mil (0.25mm)
Min Soldermask Bridge12mil (0.30mm)
Min BGA PAD Margin12mil (0.30mm)
PTH/NPTH Dia TolerancePTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation±4mil (0.10mm)
Outline ToleranceLaser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio8:1
Surface TreatmentENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance ControlledValue > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm
ItemAttribute
BrandDupont / Doosan / Grace / KB / Rogers / Panasonic / SYL / Tailfex / ThinFlex / Ventec
Base MaterialPolyimide / FR4
Base Material Thickness (FCCL)12um / 18um / 25um / 50um / 75um / 100um / 125um / 150um
Base Material Thickness (CCL)0.10mm / 0.12mm / 0.15mm / 0.20mm / 0.25mm / 0.30mm / 0.40mm / 0.50mm / 0.60mm / 0.80mm / 1.0 mm / 1.2 mm / 1.6mm / 2.0 mm
Coverlay TypePolyimide / Soldermask oil
Tg Value130 / 150 / 170
Halogen Free (optional)Yes
ROHSYes
Flammability94V-0
Dielectric Strength≥ 1.3KV/mm
Wrap & Twist≤ 1%
Prototype(<1m²)LayersNormal ServiceExpedited Service
Rigid-flex PCB2 Layers1.5 – 2 weeks5 days
3 Layers2 – 2.5 weeks6 days
4 Layers2.5 – 3.5 weeks1 week
6 Layers3.5 – 4 weeks1.5 weeks
8 – 12 Layers4 – 5 weeks2 weeks
Mass Production Layers Normal Service Expedited Service
Rigid-flex PCB 2 Layers 2.5 – 3.5 weeks 1.5 weeks
3 Layers 3 – 4 weeks 2 weeks
4 Layers 4 – 5 weeks 2.5 weeks
6 Layers 5 – 6 weeks 3 weeks
8 – 12 Layers 6 – 8 weeks 3.5 weeks

적용사례

경쟁사보다 한발 앞서 나가기 위해 현장에서 실제로 무엇이 뒷받침되어야 하는지, 저희는 그 핵심을 정확히 파악하고 있습니다.

지능형 추적 제품군에 들어가는 FR4 PCB

  • Layer Count: 4 Layers
  • PCB Type: FR4 PCB
  • Material: FR4 PCB TG150
  • Board Thickness: 1.6mm +/-10%
  • Copper Thickness: 1oz
  • Surface Treatment: ENIG(Au 1u‘’)
  • Solder Mask: Green

헬스 모니터링 기기용 초박판 PCB

  • Layer Count: 2 Layers
  • PCB Type: FR4 PCB
  • Material: FR4 PCB TG180
  • Board Thickness: 0.15mm
  • Copper Thickness: 1oz
  • Surface Treatment: ENEPIG(Au 1u‘’)
  • Solder Mask: Black

전기차 충전기용 헤비 코퍼(Heavy Copper) PCB

  • Layer Count: 6 Layers
  • PCB Type: Heavy Copper PCB
  • Material: FR4 PCB TG170
  • Board Thickness: 2.0mm +/-10%
  • Copper Thickness: 6/6/6/6/6/6oz
  • Surface Treatment: ENIG(Au 1u‘’)
  • Solder Mask: Green